The global smart wearable device market has exploded, but problems such as material aging and easy scratching on the surface have long plagued the industry. The scratch-resistant PC material developed by Dongguan Bisheng New Materials has successfully replaced Japan’s Mitsubishi KH3110UR product with high transparency (more than 93%) and surface hardness of 2H level, reducing costs by more than 30%. The material is directly applied to the heart rate window of the smart bracelet through low-temperature two-color injection molding technology (processing temperature is only 210-230℃), realizing 0.5g ultra-thin components without spraying paint molding, shortening the production cycle by 40%.
In the field of 5G communication equipment, high heat-resistant PC alloys have become a key breakthrough. The PC-545 alloy launched by Chimei Industrial has both high fluidity and flame retardancy (UL94 V-0), solving the deformation problem of routers and base station equipment caused by high temperature. Its heat deformation temperature reaches 135℃, and its fluidity is 20% higher than that of conventional PC, significantly reducing the injection molding defects of thin-walled parts. The application of low dielectric constant PC (dielectric constant 2.8-3.2@1GHz) reduces 5G antenna signal loss by 40% and increases the Wi-Fi coverage of a certain brand of router by 22%.
Environmental protection technology is upgraded simultaneously: Covestro’s Makrolon® RE series uses bio-based raw materials with mass balance certification, and its carbon footprint is 80% lower than that of traditional PC. It has been used in electronic casings in the supply chain of Huawei and Xiaomi. Wanhua Chemical uses PAN-based carbon fiber modification technology to reduce the processing temperature of PC alloy to 240-260℃ and shorten the cooling time by 30%, which is suitable for mass production of ultra-thin notebook casings.