In the field of high-end electronic equipment manufacturing, domestic PC materials are breaking the international monopoly with technological innovation. Taking smart wearable devices as an example, the scratch-resistant PC material developed by Dongguan Tianxingjian New Materials has a surface hardness of 2H and a light transmittance of over 93%. It successfully replaced the Japanese Mitsubishi KH3110UR product and reduced costs by 30%. The material is directly applied to the heart rate window of the smart bracelet through low-temperature two-color injection molding technology (processing temperature is only 210-230℃), realizing 0.5g ultra-thin components without spraying paint and shortening the production cycle by 40%.
5G communication equipment poses new challenges to signal transmission. The low dielectric constant PC (dielectric constant 2.8-3.2@1GHz) developed by Tianxingjian has become an ideal material for antenna covers, reducing the signal loss of 5G devices by 40%. After a certain brand of router adopted this material, the Wi-Fi coverage area increased by 22%110. At the same time, the insulating thermal conductive PC technology has made key progress – Huitong New Materials’ patented products achieve a thermal conductivity of ≥0.6W/(m·k) and a cantilever beam notch impact strength of ≥20KJ/m² by adding 25-40 parts of thermal conductive fillers, which perfectly solves the heat dissipation and strength balance problem of thin-walled parts such as mobile phone motherboard brackets.
Wear resistance is also a core requirement for electronic device casings. Kingfa Technology’s latest patent increases the wear resistance of PC/ABS composite materials by 50% by adding boron nitride/graphene oxide composite wear-resistant agent while maintaining high impact resistance. It has been applied to Xiaomi mobile phone casings and Lenovo laptop computer hinge components69. It is worth noting that environmental protection technology is upgraded simultaneously: Covestro’s Makrolon® RE series uses bio-based raw materials, with a carbon footprint 80% lower than traditional PC, and has passed Huawei and Xiaomi supply chain certification. In 2024, the proportion of domestic PC raw materials used in electronic equipment will exceed 50%, marking the official arrival of the era of independent and controllable technology.